Boschman Advanced Packaging Technology is Application Specific Semiconductors in Netherlands that focus on glob topping business. Founded in 1987. They cover business area such as manufacturer, semiconductor packaging equipment, mold, two major encapsulation technique, potting, glob, void-free and strong bond, high thermal and electrical conductivity.
Application Specific Semiconductors
1987
( 37 years old in 2024 )
Glob Topping
-
Stenograaf 3
6921 EX Duiven
Netherlands
Private
manufacturersemiconductor packaging equipmentmoldtwo major encapsulation techniquepottingglobvoid-free and strong bondhigh thermal and electrical conductivity
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Boschman Advanced Packaging Technology is Application Specific Semiconductors business from Netherlands that founded in 1987 (37 years old in 2024), Boschman Advanced Packaging Technology business is focusing on Glob Topping.
Boschman Advanced Packaging Technology headquarter office and corporate office address is located in Stenograaf 3 6921 EX Duiven Netherlands.
Boschman Advanced Packaging Technology was founded in Netherlands.
In 2024, Boschman Advanced Packaging Technology is currently focus on glob topping sector.
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