Chipbond Technology is Application Specific Semiconductors in Taiwan that focus on tape carrier package business. Founded in 1997. They cover business area such as Chipbond Technology Corp, its subsidiary, development, manufacturing, sale, gold bump, solder bump, flip chip, tape automate bonding, tape carrier package.
Application Specific Semiconductors
1997
( 27 years old in 2024 )
Tape Carrier Package
-
No. 3, Li Hsin 5th Road
Hsinchu Science Park
Hsinchu, 300
Taiwan
Private
Chipbond Technology Corpits subsidiarydevelopmentmanufacturingsalegold bumpsolder bumpflip chiptape automate bondingtape carrier package
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Chipbond Technology is Application Specific Semiconductors business from Taiwan that founded in 1997 (27 years old in 2024), Chipbond Technology business is focusing on Tape Carrier Package.
Chipbond Technology headquarter office and corporate office address is located in No. 3, Li Hsin 5th Road Hsinchu Science Park Hsinchu, 300 Taiwan.
Chipbond Technology was founded in Taiwan.
In 2024, Chipbond Technology is currently focus on tape carrier package sector.
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