Datacon Technology is Application Specific Semiconductors in Austria that focus on die bonders business. Founded in 1986. They cover business area such as manufacturer, high-precision assembly equipment, semiconductor and telecommunications industry, flip chip bonder, multi-chip die bonder, sorter, RFID (radio frequency identification.
Application Specific Semiconductors
1986
( 38 years old in 2024 )
Die Bonders
-
Innstrasse 16
Radfeld, 6240
Austria
Private
manufacturerhigh-precision assembly equipmentsemiconductor and telecommunications industryflip chip bondermulti-chip die bondersorterRFID (radio frequency identification
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Datacon Technology is Application Specific Semiconductors business from Austria that founded in 1986 (38 years old in 2024), Datacon Technology business is focusing on Die Bonders.
Datacon Technology headquarter office and corporate office address is located in Innstrasse 16 Radfeld, 6240 Austria.
Datacon Technology was founded in Austria.
In 2024, Datacon Technology is currently focus on die bonders sector.
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