FlipChip International is Other Commercial Services in United States that focus on level packaging services business. Founded in 1996. They cover business area such as Provider, flip chip bumping, advanced wafer level packaging service, engineering excellence, device miniaturization, innovation, a method, semiconductor device, external circuitry, solder bump, chip pad, automotive, commercial, consumer, industrial, medical and military market, more processing power, layer wafer, a device, more computing power.
1996
( 28 years old in 2024 )
Level Packaging Services
-
3701 East University Drive
Phoenix, AZ 85034
United States
Private
Providerflip chip bumpingadvanced wafer level packaging serviceengineering excellencedevice miniaturizationinnovationa methodsemiconductor deviceexternal circuitrysolder bumpchip padautomotive, commercial, consumer, industrial, medical and military marketmore processing powerlayer wafera devicemore computing power
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FlipChip International is Other Commercial Services business from United States that founded in 1996 (28 years old in 2024), FlipChip International business is focusing on Level Packaging Services.
FlipChip International headquarter office and corporate office address is located in 3701 East University Drive Phoenix, AZ 85034 United States.
FlipChip International was founded in United States.
In 2024, FlipChip International is currently focus on level packaging services sector.
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