Microelectronics Assembly Technologies is Consulting Services (B2B) in United States that focus on flip-chip packaging business. Founded in 2006. They cover business area such as operator, a consult firm, design, consulting, assembly, service, flex circuit, flip-chip packaging, radiation detector, high density, multi-chip modular packaging and bio-medical sensor, performance, enable semiconductor business, a host, thermal, power, size, and reliability barrier.
2006
( 18 years old in 2024 )
Flip-chip Packaging
-
The Lab, 104 T.W. Alexander Drive
Building 7, Room 727, Post Office Box 13279
Research Triangle Park, NC 27711
United States
Private
operatora consult firmdesignconsultingassemblyserviceflex circuitflip-chip packagingradiation detectorhigh densitymulti-chip modular packaging and bio-medical sensorperformanceenable semiconductor businessa hostthermal, power, size, and reliability barrier
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Microelectronics Assembly Technologies is Consulting Services (B2B) business from United States that founded in 2006 (18 years old in 2024), Microelectronics Assembly Technologies business is focusing on Flip-chip Packaging.
Microelectronics Assembly Technologies headquarter office and corporate office address is located in The Lab, 104 T.W. Alexander Drive Building 7, Room 727, Post Office Box 13279 Research Triangle Park, NC 27711 United States.
Microelectronics Assembly Technologies was founded in United States.
In 2024, Microelectronics Assembly Technologies is currently focus on flip-chip packaging sector.
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