Shenzhen Danbond Technology Company is General Purpose Semiconductors in China that focus on Technology Co Ltd business. Founded in 2001. They cover business area such as Shenzhen Danbond Technology Co Ltd, development, manufacturing, flexible circuit, its material, its main product, flexible FCCL, high-intensity FPC, COF circuit, chips encapsulation, encapsulation product, encapsulation-relate heat, application, commercial electronic, medical device, special computer, digital display, high-tech equipping industry, national defense, military, airspace.
General Purpose Semiconductors
2001
( 23 years old in 2024 )
Technology Co Ltd
-
Danbond Technology Building No. 8
Langshan Yi Road, North Zone, Hi-Tech Park
Shenzhen, 518057
China
Private
Shenzhen Danbond Technology Co Ltddevelopmentmanufacturingflexible circuitits materialits main productflexible FCCLhigh-intensity FPCCOF circuitchips encapsulationencapsulation productencapsulation-relate heatapplicationcommercial electronicmedical devicespecial computerdigital displayhigh-tech equipping industrynational defensemilitaryairspace
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Shenzhen Danbond Technology Company is General Purpose Semiconductors business from China that founded in 2001 (23 years old in 2024), Shenzhen Danbond Technology Company business is focusing on Technology Co Ltd.
Shenzhen Danbond Technology Company headquarter office and corporate office address is located in Danbond Technology Building No. 8 Langshan Yi Road, North Zone, Hi-Tech Park Shenzhen, 518057 China.
Shenzhen Danbond Technology Company was founded in China.
In 2024, Shenzhen Danbond Technology Company is currently focus on Technology Co Ltd sector.
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